Graphite laika, n-nan ai carbon{0}} hpe madung tawn ai laika buk hpe shingra tara graphite (sh) grai n-gun ja ai pyrolytic graphite (HOPG) kaw na galaw da ai. Dai gaw, graphite a kaja dik htum ai wan n-gun, n-gun rawng ai lam, chemical stability, laika buk a nhtoi, n-gun n-gun, n-gun n-gun ni hpe kayau kaya galaw ai. Shi a hpan da ai lam gaw, arung arai hpaji masa hta ahkyak ai awng dang lam langai sha n-ga, n-gun atsam, electronic, hte grup yin zawn re ai ginra ni hta, hpaji masa hpaji ningnan ni hpe shabyin ya ai hte hpaji masa hpe grau sung ai hku chye na ai lam ni hpe grau sung hkra galaw lu ai atsam hpe madun dan nga ai.
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Graphite laika buk a hpaji masa ahkyak ai lam hpe madung hku nna, n-gun n-gun hte macroscopic atsam ni a lapran na laklai ai matut mahkai lam hta dan dawng nga ai. Htunghking graphite arung arai ni gaw law malawng gaw law law (sh) powder hkrang hku sha nga ai majaw, n-gun n law ai hte n-gun n rawng ai application ni hta hkrak sha jai lang na matu yak hkak nga ai. Raitim, graphite microshets ni hpe interlayer stacking hpe hkang ai hku nna (p2 hybridized carbon layers nkau mi a hkan sa ai hkrang hpe n-gun n rawng ai hku tawn da ai), graphite laika gaw, macroscopic continuum de lahkawng lang-ddimensional nanosheet ni kaw na cross{2}} scale hpe lu la ai. Shi a shinggyim hkum hkrang n-gun gaw 0.05{8}}1mm sha rai nna, shi a density gaw 2.1{10}2.3g/cm3 daram rai nga ai (graphite a theoretical density hte ni ai). Raitim, dai gaw 1000-3000 W/(m·K) a in{15}plane thermal conductivity hpe gumrawng gumtawng nga ai (m·K langai sha lawm ai graphene hte shingdaw mai ai), wan n-gun hpe 10⁵-10 100 a wan n-gun (copper 80% daram), hte grai kaja ai chemical inertness (acid and alkali ninghkap ai lam, hte oxidation hpe ninghkap lu ai). Ndai zawn n-gun n law ai, n-gun kaba ai, ngang grin ai lam ni hpe kahkyin gumdin ai gaw, htunghking arung arai ni a shingra tara hku nna galaw lu ai atsam hpe tawt lai lu ai, n-gun dat hpe htawt sit ai hta thermal management mayak mahkak ni hpe hparan na matu ahkyak ai arung arai npawt nhpang hpe jaw ya ai hte electronic jak ni hta galai shai ai wan n-gun hpe galai shai ra ai lam ni hpe hparan ya lu ai.
2. N-gun atsam hte seng ai hpaji ningnan: N-gun atsam hte n-gun atsam hpe grau kaja hkra galaw ya ai
N-gun hpaji masa hta lawan ai hku rawt jat wa ai lam ni a shingdu kaw nna, graphite laika buk a madung manu hpe madung hku nna thermal management hta madun dan ai. Hpa majaw nga yang, 5G base station chips hte n-gun n-gun mawdaw nnan ni zawn re ai), bungli galaw ai lam hpe jahten sharun ai lam ni hte, buga ginra hta grai katsi ai majaw byin pru wa ai shimlam mabyin ni hpe pyi, grai law hkra jai lang wa ai majaw, n-gun kaba dik htum byin wa sai. Graphite paper, shi a ultra- ntsa e, thermal conductivity hta, n-gun rawng ai hku n-gun rawng ai hku galaw ai (ga shadawn, interlayer hte dingyang nga ai maga de na thermal conductivity gaw 10 W/(m·K) daram sha rai nga ai),{{7}plane maga de hkying hkum law law du lu ai). Ndai lam gaw battery thermal diffusion layers (Tasla a 4680 battery hta graphite heat dissipation film zawn re ai) ni hta grai lang ai hte LED chips ni a matu heat dissipation substrates hku nna jai lang ai. Chyam dinglik ai lam ni hta mu lu ai gaw, lithium battery module ni hta graphite paper buffer layer hpe jat bang ai shaloi, charge galaw ai aten hta grau katsi ai hpe 15-20℃hte shayawm kau lu nna, cycle a prat hpe 30% jan jat ya lu ai.
Graphite paper gaw n-gun hpe shinggyin tawn ai jak ni hta mung ahkyak ai shara hpe hkam la nga ai. Supercapacitor ni a matu n-gun rawng ai electrode arung arai langai hku nna, shi a n-gun kaba ai gaw, lapran na n-gun hpe shayawm ya lu ai (htunghking shamu shamawt ai carbon electrode ni hta 50% jan yawm ai). Shi a layered structure gaw, ions ni a matu lawan ai-dimensional diffusion lam lahkawng hpe jaw ya ai (Li⁺ hte Na⁺ zawn re ai), dai jak hpe, n-gun rawng ai aten hta pyi, 90% jan hpe n-gun jaw lu ai. Grau nna, graphite paper gaw solid-state electrolyte membrane ni a matu madi shadaw ai substrate langai hku nna galaw lu ai. Surface functionalization (sulfonic acid hpung ni hpe hpaw hpang ai zawn re ai) gaw lithium metal battery ni hta lithium ions ni hpe langai sha re ai deposition hpe jat ya lu ai, dendrite rawt jat lam hpe pat shingdang ya lu ai, dai majaw battery hpe shim lum hkra galaw ya lu ai.
3. Electronics hte hkam kaja lam hpe n-gun jaw ai lam: Flexible Electronics a matu Cornerstone arung arai langai
N-gun n rawng ai electronic jak ni hpe lawan ladan galaw shapraw ai (hpun palawng n-gun rawng ai sensor ni hte shinggrup mai ai screen touchscreens zawn re ai), htunghking hku nna n-gun ja ai conductive arung arai ni ( metal film ni hte indium tin oxide (ITO) zawn re ai) ni gaw shanhte a n-gun n rawng ai hte n-gun n rawng ai majaw ndai ra kadawn ai lam ni hpe n lu galaw ai. Graphite laika buk a n-gun atsam hte n-gun rawng ai lam ni a lahkawng lang na atsam ni gaw, dai hpe kaja dik ai ladat langai hku nna shabyin ya ai: 10⁵ bends (1mm npu na curvature radius hte) hpe n-gun n sum ai sha hkam sharang lu ai, asan sha galaw ai machining (ga shadawn, htum mat ai hte gap ai zawn re ai) hku nna gara hkrang de raitim byin pru wa lu ai. Ga shadawn, n-gun rawng ai strain ni hta, graphite paper hpe elastic polymers ni hte shingdaw nna, wan n-gun hte n-gun n-gun hpe hkam sha lu ai atsam hpe jai lang nna, n-gun n-gun hte n-gun n-gun (5–10 a sensitivity coefficient (GF) hte) hpe jai lang ai, dai gaw minute galai shai ai lam ni hpe n-gun ja ai-precision hku nna yu reng lu ai (shinggyim masha a n-gup hte n-gup n-gu shamu shamawt ai zawn re ai) hpe yu reng lu ai. Electronic skin hte seng nna, graphite paper-amyu ni gaw -20℃du hkra na 150℃du hkra n-gun kaba ai nbung laru lapran hta ngang grin ai hku bungli galaw lu ai, biomimetic robot ni hta tactile ningmu ni hpe madung tawn nna hpaji masa hku nna madi shadaw ya lu ai.
4. Hkringmang hte shim lum ai hpaji masa hta byin mai ai manu dan ai lam
graphite laika buk a hpaji masa ahkyak ai lam gaw grup yin hpe makawp maga ai lam de mung jat wa ai. Shi a raw material, graphite gaw, mungkan a npawt nhpang hta mu lu ai carbon arung arai law law nga ai (global shingra tara graphite reserve ni gaw ton wan 300 jan ai). Dai hta n-ga, galaw shapraw ai lam gaw, n kaja ai graphite electrode ni hpe bai jai lang na matu ahkang jaw ai (steel galaw ai kaw na zawn re ai), resource bai jai lang ai lam hpe lu la na matu, green chemistry a npawt tara ni hte maren. Dai hta n-ga, graphite paper a porous structure (shi a porosity hpe hkang zing da ai oxidation-reduction process hku nna gram lajang mai ai) gaw, n-gun ja ai magri ions ni hte organic dye zawn re ai awu asin ni hpe grai kaja ai hku galaw lu ai atsam hpe madun dan lu ai. Amino-functionalized graphite paper gaw Pb20 a matu 280 mg/g hpe hkap la lu ai atsam hpe lu la mai ai hpe chyam dinglik ai lam ni hta mu lu ai, dai gaw shamu shamawt ai carbon (100 mg/g daram) hta grau law ai hpe mu lu ai. Aten galu hta, dat kasa carbon- hpe madung tawn ai bungli galaw ai arung arai langai hku nna, graphite laika buk gaw, carbon neutrality hpe lu la na matu yaw shada ai, "carbon{111111111111111111111111111111111111111111111111111111111111111111111111111111111111111111111111111111111) ni a matu, arung arai npawt nhpang nnan hpe jaw ya ai.
graphite laika buk a hpaji masa ahkyak ai lam gaw, shi a hkrang shapraw ai lam hta sha n-ga, "bridge material" hku nna shi a lit hta mung lawm nga ai: madung sawk sagawn ai lam hte engineering application ni hpe shingdaw ai: n-gun atsam, electronic, hte grup yin hpaji masa ni hta hpaji ningnan ni hpe n-gun jaw ai du hkra, madung sawk sagawn ai lam hte engineering application ni hpe hpaw shadan dan ai kaw nna. Hkyen lajang ai lam ni hpe grau kaja hkra galaw ai (ga shadawn, chemical vapor deposition (CVD) hpe jai lang nna, bungli hkrang shapraw ai lam hta grau nna rawt jat wa ai lam ni (ga shadawn, nitrogen (sh) boron atom ni hte ka-up nna, electronic hkrang hpe galai shai ai lam zawn re ai), graphite paper gaw shi a jai lang ai lamu ga jarit ni hpe matut nna jat wa nna, Mali ngu na Industrial Rawt Malan ai lam hpe madi shadaw ai madung npawt nhpang arung arai langai mi tai wa na hpe myit mada ai.
