Graphite Micro hka htung

1. Hpaga lam a madung

Graphite Micro powder gaw, n-gun ja ai-san seng ai shingra tara graphite (sh) shinggyim masha ni galaw ai graphite kaw na, n-gun n rawng ai, n-gun rawng ai, san seng ai zawn re ai hkrak ai ladat ni hku nna galaw shapraw ai, grai n-gun rawng ai graphite powder rai nga ai. Shi a madung manu gaw, graphite a layered crystal structure a akyu ara ni hpe micro particle size optimization hku nna grau grau jat wa hkra galaw ai hta rai nga ai, dai gaw grai kaja ai n-gun dat, n-gun dat, n-gun ja ai n-gun hpe hkam sharang lu ai atsam, hte chemical n-gun ja ai lam ni hpe kayau kaya galaw lu ai rai nna, n-gun ja ai powder arung arai ni hpe "hpaji rawng ai hte bungli galaw lu ai atsam" hpe hkap la lu ai.

2. Madung hpaji masa ni

3.Product a madung lam ni

(1) Ultra-kaji ai n-gun n-gun hte maren mara garan ginhka ai lam

100nm-5 μm ultrafine masat masa ni hpe gram lajang mai ai, n-gun garan ai span kaji ai (Span<=0.8), agglomeration byin ai lam n nga ai, matrix hpe garan ginhka ai hta loi ai, matrix hpe garan ginhka ai hta loi ai.

(2) San seng ai lam tsaw ai hte n san seng ai lam n law ai

Graphite Micro powder hta 99.5% hta grau kaba ai (sh) maren sha re ai n-gun rawng ai carbon n-gun (99.95% hta grau ai (sh) maren sha re ai n-gun rawng ai n-gun rawng ai high-end masat masa ni hte 0.5% hta n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai (ultrafine n-gun rawng ai n-gun rawng ai). Dai gaw, sulfur hte phosphorus zawn re ai n kaja ai awu asin ni n lawm ai majaw, jai lang ai lam ni hpe awu asin byin shangun ai (sh) dai ni hte bungli galaw ai lam hpe pat shingdang ai lam ni hpe koi gam lu ai.

(3) Hkum hkrang hte tsi hpaji hta grai kaja ai atsam marai ni

Conductivity: Volume resistivity 10 Ω·cm hta n law ai (sh) maren sha rai yang, n-gun rawng ai filler hku nna lang nna, n-gun rawng ai arung arai ni hpe n-gun rawng hkra galaw mai ai;

Sau htu ai lam: Mohs n-gun 1-2, n-gun n-gun 0.15 hta n-pu (sh) maren sha, sau n lawm ai sau htu ai masa hta magri sau ni hpe galai shai ya lu ai;

Katsi ai hpe hkam sharang lu ai atsam kaba ai: Inert gas hta 3000℃jan ai katsi ai hpe hkam sharang lu ai, n-gun n rawng ai, n-gun n rawng ai, n-gun n rawng ai (2-5 × 10−6/℃);

Chemical n-gun: Acid, alkali, hte organic solvent ni a n-gun hpe ninghkap lu ai, pH 2-12 makau grup yin hta n-gun n rawng ai, chemical n-gun law malawng hte n-gun n rawng ai.

(4) Kaja ai Processing hpe galai shai lu ai atsam

Dai powder gaw lwi ai atsam kaja nga ai (angle of repose 35℃hta n law ai (sh) maren sha re), resin, rubber, magri powder zawn re ai npu na n-gun ni hte kayau na matu loi ai, n-gun n-gun a npawt nhpang hkrang hpe n jahten kau ai. Dai hpe compression n-gun dat, injection n-gun dat, coating zawn re ai ladat ni hku nna amyu myu hku galaw mai ai.

 

 

4. Madung jai lang na shara ni

(1) Sau htu ai bungli

Bearing, gear, valve zawn re ai jak rung arung arai ni hta bang da ai sau sau langai zawn;

Solid lubricating coatings ni hpe hkyen lajang na matu (ga shadawn, nbung n-gun jak ni, nbungli hte seng ai arung arai ni a matu sau);

Lubricating oil/grease additive hku nna lang ai gaw, sau a prat hpe grau kaja hkra galaw ya lu ai hte grai sawng ai bungli masa ni hta htuk manu hkra galaw lu ai.

(2) N-gun atsam nnan

Lithium battery n kaja ai electrode hpe n-gun jaw ai: N kaja ai electrode arung arai ni (ga shadawn, graphite, silicon-madung tawn ai arung arai ni) a n-gun hpe jat ya ai, battery kata na n-gun hpe shayawm ya ai, charge-discharge n-gun hpe jat ya ai hte cycle prat hpe jat ya ai;

Fuel cell bipolar plate coating: Bipolar plate ni a n-gun hte n-gun n-gun hpe jat ya ai, matut mahkai ai lam hpe shayawm ya ai.

(3) Coatings hte Ink hpaga lam

Conductive coatings: Anti-static npu npu, wan n-gun hpe makawp maga ai n-gup magap, wan n-gun n-gun hpe makawp maga ai n-gup magap ni a matu lang ai;

Hka lum ai hpe hkam sharang lu ai coating: Boiler hte kiln ni a kata bunghku ni hpe hka lum ai hpe hkam sharang lu ai hte n-gun ja ai hpe hkam sharang lu ai coating galaw na matu lang ai;

Special ink: Ink hpe dip shapraw ngut ai hpang, n-gun n rawng hkra, n-gun rawng ai ink (ga shadawn, n-gun rawng ai electronic circuit, RFID tags) hpe hkyen lajang ya ai.

(4) Hpri hte n-gun n rawng ai arung arai ni

Metallurgical makawp maga ai slag: Matut manoi htu ai shaloi, ntsin zawn re ai slag film hpe shabyin ya nna, nbung hpe garan ginhka ya ai, billet hpe sau bang ya ai, ntsa na n kaja ai lam ni hpe shayawm ya ai;

Refractory bricks/refractory coatings: N-gun ja ai -n-gun ja ai arung arai ni rai nga ai n-gang hte shingnip shingna ni hta lang ai n-gun ja ai arung arai ni a n-gun ja ai n-gun hte n-gun ja ai n-gun hpe hkam sharang lu ai atsam hpe jat ya ai.

(5) Electronic hte hkrak hkrak galaw shapraw ai lam

Electronic shingnip shingnap arung arai ni: Chip katsi ai hpe shapraw kau lu ai atsam hpe grau kaja hkra galaw na matu epoxy resin shingnip shingnap ai arung arai ni hta thermal/conductive fillers hku nna jat bang ai;

Hkrak ai hku hpraw hkra galaw ai: Semiconductor silicon wafers hte optical glass ni hpe hkrak hkra hpraw hkra galaw na matu lang nna, ntsa na nsam hpe shayawm ya ai (Ra du hkra 0.01 μm hta n law ai (sh) maren sha re).

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